Shenzhen Jaguar Automation Equipment Co., Ltd
Shenzhen Jaguar Automation Equipment Co., Ltd
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Lead-free Hot Air Wave Soldering Machine N200 Compact Wave Welding Machine
The compact size Wave Soldering machine is a high-performance Lead-free Wave Soldering machine, which is special designed for middle and small-sized enterprises, this machine use PLC control system, 1 hot air preheating zone, with variable-frequency speed control system, intelligent flux spray system, this compact wave soldering is energy saving, high presicion of temprature, easy operating and high performance cost ratio.
| Model No | JAGUAR N200 |
| Number of Pre-heater | 1 |
| Pre-heater passage | 450mm |
| Body size | 1400*1200*1600 |
| Outside dimension | 2100*1200*1600 |
| Weight | 500KG |
| Component lead | Within 10 mm |
| Total/steady consumption | 9KW/3-5KW |
| Air supply | 0.5MPa |
| Preheating style | IR(standard) |
| Preheater consumption | 220V 5KW |
| Control method | Press key +PLC |
| Range of temp. setpoint | Room temperature---300ºC |
| Preheating time | About 10-15mins for setting 150ºC |
| Solder Application | Lead-free / Sn-Pb |
| Solder pot capacity | 180KG |
| Solder pot temperature | 300ºC |
| Solder pot consumption | 380V 6KW |
| Solder temp. control method | PID&SSR |
| Wave motor consumption | 500W 220V |
| Solder melting | About 120mins for setting 250ºC |
| PCB width | 50-250mm |
| Conveyor speed | 300-1800mm/min |
| Conveyor direction | L→R (R→L optional) |
| Conveyor inclination | 4-7 º |
| Flux pressure | 3-5 bar |
| Flux capacity | 3.2L |
1. Automatic conveying power system and auto synchronous board feeding functions.
2. Solder Pot peak uses frequency conversing speed adjustment which can independently control the wave height.
3. Fluxer system using transverse Japanese spray nozzle, driven by pneumatic cylinder and PLC control, accurate and reliable.
4. PLC is used to control the machine, to ensure the reliability and stability of the system.
5. Pre-heaters using Infrared heating element, heat radiated efficiently to the circuit board with fast ramp up and fully activating liquid flux.
6. Special alloy solder fingers, strengthened double v-groove.
